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1

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Zeng, Kejun, Stierman, Roger, Chiu, Tz-Cheng, Edwards, Darvin, Ano, Kazuaki, Tu, K. N.

Journal:

Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 1.17 MB

english, 2005

2

[IEEE Thermal and Thermomechanical 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - San Diego, CA (May 30-June 2, 2006)] Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating

Kejun Zeng,, Stierman, R., Abbott, D., Murtuza, M.

Year:

2006

Language:

english

File:

PDF, 2.03 MB

english, 2006

3

Lead-free soldering: Materials science and solder joint reliability

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2009

Language:

english

File:

PDF, 193 KB

english, 2009

4

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

Kejun Zeng, Roger Stierman, Don Abbott, Masood Murtuza

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2006

Language:

english

File:

PDF, 925 KB

english, 2006

5

In situ LA–MC–ICP–MS boron isotope and zircon U–Pb age determinations of Paleoproterozoic borate deposits in Liaoning Province, northeastern China

Hu, Guyue, Li, Yanhe, Fan, Changfu, Hou, Kejun, Zhao, Yue, Zeng, Lingsen

Journal:

Ore Geology Reviews

Year:

2015

Language:

english

File:

PDF, 3.38 MB

english, 2015

6

Neoproterozoic magmatism in eastern Himalayan terrane

Wang, Yuhua, Zeng, Lingsen, Gao, Li-E, Guo, Chunli, Hou, Kejun, Zhang, Lifei, Wang, Wei, Sun, Huiyi

Journal:

Science Bulletin

Year:

2017

Language:

english

File:

PDF, 3.51 MB

english, 2017

7

Eocene-Oligocene potassic high Ba Sr granitoids in the Southeastern Tibet: Petrogenesis and tectonic implications

Wang, Wei, Zeng, Lingsen, Gao, Li-E, Wang, Qian, Guo, Chunli, Hou, Kejun, Liu-Zeng, Jing

Journal:

Year:

2018

Language:

english

File:

PDF, 32.41 MB

english, 2018

8

Self-assembly of granular spheres under one-dimensional vibration

Amirifar, Reza, Dong, Kejun, Zeng, Qinghua, An, Xizhong

Journal:

Year:

2018

Language:

english

File:

PDF, 7.05 MB

english, 2018

9

Early Paleozoic magmatism along the northern margin of East Gondwana

Gao, Li-E, Zeng, Lingsen, Hu, Guyue, Wang, Yaying, Wang, Qian, Guo, Chunli, Hou, Kejun

Journal:

Year:

2019

Language:

english

File:

PDF, 27.67 MB

english, 2019

10

Highly sensitive determination of L-tyrosine in pig serum based on ultrathin CuS nanosheets composite electrode

Zhu, Qin, Liu, Chu, Zhou, Li, Wu, Ling, Bian, Kejun, Zeng, Julan, Wang, Jianxiu, Feng, Zemeng, Yin, Yulong, Cao, Zhong

Journal:

Biosensors and Bioelectronics

Year:

2019

Language:

english

File:

PDF, 10.14 MB

english, 2019

11

Bimodal self-assembly of granular spheres under vertical vibration

Amirifar, Reza, Dong, Kejun, Zeng, Qinghua, An, Xizhong

Journal:

Year:

2019

Language:

english

File:

PDF, 2.59 MB

english, 2019

12

CDEX Dark Matter Experiment: Status and Prospects

Ma, Hao, Chen, Yang, Yue, Qian, Wang, Li, Xue, Tao, Zeng, Zhi, Kang, Kejun, Cheng, Jianping, Li, Yuanjing, Li, Jianmin, Li, Yulan

Journal:

Journal of Physics Conference Series

Year:

2020

File:

PDF, 914 KB

2020

13

Quantitative assessment of the effect of ABCA1 R219K polymorphism on the risk of coronary heart disease

Yang Li, Kefu Tang, Kejun Zhou, Zhiyun Wei, Zhen Zeng, Lin He, Chunling Wan

Journal:

Molecular Biology Reports

Year:

2012

Language:

english

File:

PDF, 271 KB

english, 2012

14

Foreword

Fu Guo, Carol A. Handwerker, Srinivas Chada, Fay Hua, Kejun Zeng

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 54 KB

english, 2009

15

Foreword

Sinn-wen Chen, Srinivas Chada, Chih-ming Chen, Hans Flandorfer, A. Lindsay Greer, Jae-Ho Lee, Kejun Zeng, Katsuaki Suganuma

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 31 KB

english, 2009

16

Foreword

Chih-ming Chen, Srinivas Chada, Sinn-wen Chen, Hans Flandorfer, A. Lindsay Greer, Jae-ho Lee, Kejun Zeng, Yee-wen Yen, Wojciech Gierlotka, Chao-hong Wang

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 52 KB

english, 2009

17

Foreword

Sung K. Kang, Iver Anderson, Srini Chada, Jeng-Gong Duh, Laura J. Turbini, Albert Wu, C. Robert Kao, Fay Hua, K. N. Subramanian, Darrel Frear, Carol Handwerker, Fu Guo, Nik Chawla, Kejun Zeng

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 70 KB

english, 2009

18

Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

Kejun Zeng, Mike Pierce, Hiroshi Miyazaki, Becky Holdford

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 933 KB

english, 2012

19

Investigation of the nitrogen-nickel-titanium system: The isothermal section at 900 °C

Yannick Le Friec, Peter Rogl, Josef Bauer, Marcel Bohn, Kejun Zeng, Rainer Schmid-Fetzer

Journal:

Journal of Phase Equilibria

Year:

1998

Language:

english

File:

PDF, 3.74 MB

english, 1998

20

Zircon U–Pb and Lu–Hf isotopic systematics of the Daping plutonic rocks: Implications for the Neoproterozoic tectonic evolution of the northeastern margin of the Indochina block, Southwest China

Xuexiang Qi, Lingsen Zeng, Luhua Zhu, Zhaocuo Hu, Kejun Hou

Journal:

Gondwana Research

Year:

2012

Language:

english

File:

PDF, 1.52 MB

english, 2012

21

Optimization and calculation of the Hf-Ni phase diagram

Kejun Zeng, Zhanpeng Jin

Journal:

Journal of the Less Common Metals

Year:

1990

Language:

english

File:

PDF, 380 KB

english, 1990

22

Thermodynamic analysis of stable and metastable equilibria in the Cu-Cr system

Kejun Zeng, Marko Hämäläinen

Journal:

Year:

1995

Language:

english

File:

PDF, 793 KB

english, 1995

23

Thermodynamics of the Ni–H system

Kejun Zeng, T. Klassen, W. Oelerich, R. Bormann

Journal:

Journal of Alloys and Compounds

Year:

1999

Language:

english

File:

PDF, 270 KB

english, 1999

24

Thermodynamic analysis of the hydriding process of Mg–Ni alloys

Kejun Zeng, T. Klassen, W. Oelerich, R. Bormann

Journal:

Journal of Alloys and Compounds

Year:

1999

Language:

english

File:

PDF, 308 KB

english, 1999

25

RETRACTED ARTICLE: Analysis of DNA methylation polymorphism in a set of stable chromosome translocation lines

Li, Shuangrong, Zhang, Yong, Deng, Kejun, Peng, Jinhua, Zeng, Xuelian, Zhang, Huaiqiong, Ren, Zhenglong

Journal:

Molecular Breeding

Year:

2013

Language:

english

File:

PDF, 457 KB

english, 2013

26

A thermodynamic calculation of the Ni-Nb phase diagram

Kejun, Zeng, Xianzhang, Zeng, Zhanpeng, Jin

Journal:

Journal of Alloys and Compounds

Year:

1992

Language:

english

File:

PDF, 448 KB

english, 1992

27

Episodic crustal anatexis and the formation of Paiku composite leucogranitic pluton in the Malashan Gneiss Dome, Southern Tibet

LiE Gao, LingSen Zeng, KeJun Hou, ChunLi Guo, SuoHan Tang…

Journal:

Chinese Science Bulletin

Year:

2013

Language:

english

File:

PDF, 1.43 MB

english, 2013

28

Retraction Note: Analysis of DNA methylation polymorphism in a set of stable chromosome translocation lines

Li, Shuangrong, Zhang, Yong, Deng, Kejun, Peng, Jinhua, Zeng, Xuelian, Zhang, Huaiqiong, Ren, Zhenglong

Journal:

Molecular Breeding

Year:

2013

Language:

english

File:

PDF, 95 KB

english, 2013

29

Thermodynamic modeling of intermetallic compounds in the Ni-Nb system

Kejun, Zeng, Zhanpeng, Jin

Journal:

Scripta Metallurgica et Materialia

Year:

1992

Language:

english

File:

PDF, 265 KB

english, 1992

30

DEPUTATION OF THE MEDICAL CLUB TO THE CHANCELLOR OF THE EXCHEQUER.

Kejun, Zeng, Zhanpeng, Jin

Journal:

Year:

1869

Language:

english

File:

PDF, 184 KB

english, 1869

31

Reviews and Notices of Books.

Kejun, Zeng, Zhanpeng, Jin

Journal:

Year:

1892

Language:

english

File:

PDF, 544 KB

english, 1892

32

Thermodynamic modeling of the laves phases in the CrZr system

Zeng, Kejun, Marko, Hämäläinen, Kaj, Lilius

Journal:

Year:

1993

Language:

english

File:

PDF, 544 KB

english, 1993

33

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Effect of Cu content on the interfacial reliability of SnAgCu solder joints

Zeng, Kejun, Holdford, Becky

Year:

2010

Language:

english

File:

PDF, 8.87 MB

english, 2010

34

Amorphous layer formation at the TaC/Cu interface in the Si/TaC/Cu metallization system

Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Ilkka

Journal:

Applied Physics Letters

Year:

2002

Language:

english

File:

PDF, 499 KB

english, 2002

35

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu,, Kejun Zeng,, Stierman, R., Edwards, D., Ano, K.

Year:

2004

Language:

english

File:

PDF, 751 KB

english, 2004

36

Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

Kejun Zeng, V. Vuorinen, J. Kivilahti

Year:

2002

Language:

english

File:

PDF, 829 KB

english, 2002

37

Failure mechanism of Ta diffusion barrier between Cu and Si

Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Ilkka

Journal:

Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 832 KB

english, 2000

38

Effect of oxygen on the reactions in the Si/Ta/Cu metallization system

Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyriki, Suni, Ilkka

Journal:

Journal of Materials Research

Year:

2001

Language:

english

File:

PDF, 663 KB

english, 2001

39

Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester

Xu, Yuhuan, Ou, Shengquan, Tu, K.N., Zeng, Kejun, Dunne, Rajiv

Journal:

Journal of Materials Research

Year:

2008

Language:

english

File:

PDF, 828 KB

english, 2008

40

An array of leaf-like Co 3 Ni microstructures with ferromagnetic properties, superhydrophobic properties and high catalytic performance in the hydrolysis of ammonia borane

Zeng, Tao, Liao, Jinyun, Li, Hao, Feng, Kejun, Li, Liling

Journal:

Year:

2015

Language:

english

File:

PDF, 897 KB

english, 2015

41

Mathematical modelling and study of the encoding readout scheme for position sensitive detectors

Yue, Xiaoguang, Zeng, Ming, Zeng, Zhi, Wang, Yi, Wang, Xuewu, Zhao, Ziran, Cheng, Jianping, Kang, Kejun

Journal:

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Year:

2016

Language:

english

File:

PDF, 2.26 MB

english, 2016

42

[IEEE IEEE Symposium Conference Record Nuclear Science 2004. - Rome, Italy (16-22 Oct. 2004)] IEEE Symposium Conference Record Nuclear Science 2004. - Local feature recognition for industrial radiation imaging with DWT and SVMs

Jie Zeng,, Zheng Li,, Kejun Kang,, Liang Li,

Year:

2004

Language:

english

File:

PDF, 1.07 MB

english, 2004

43

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effect of high temperature bake on evolution of interfacial structure in Cu wire bonds and its impact on Cu/Al interfacial corrosion

Zeng, Kejun, Nangia, Amit

Year:

2015

Language:

english

File:

PDF, 1.56 MB

english, 2015

44

Reliability of Tantalum Based Diffusion Barriers between Cu and Si

Laurila, Tomi, Zeng, Kejun, Seppälä, A., Molarius, Jyrki, Suni, Ilkka, Kivilahti, Jorma K.

Journal:

MRS Proceedings

Year:

2000

Language:

english

File:

PDF, 859 KB

english, 2000

45

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Reduction of Cu-Ni-Pd pad discoloration caused by Cu re-deposition

Clemente, Laura May Antoinette, Zeng, Kejun, Nangia, Amit

Year:

2016

File:

PDF, 155 KB

2016

46

Optimization of Degradable Road Network Considering VMS Information and Heterogeneous ATIS Users

Zeng, Minghua, Long, Kejun, Han, Lee D., Yang, Xiaoguang

Journal:

Journal of Computing in Civil Engineering

Year:

2017

Language:

english

File:

PDF, 432 KB

english, 2017

47

Modification of Ammonia Decomposition Activity of Ruthenium Nanoparticles by N-Doping of CNT Supports

Bell, Tamsin E., Zhan, Guowu, Wu, Kejun, Zeng, Hua Chun, Torrente-Murciano, Laura

Journal:

Topics in Catalysis

Year:

2017

Language:

english

File:

PDF, 1.77 MB

english, 2017

48

Half-Metallic Behavior in 2D Transition Metal Dichalcogenides Nanosheets by Dual-Native-Defects Engineering

Tong, Yun, Guo, Yuqiao, Mu, Kejun, Shan, Huan, Dai, Jun, Liu, Yi, Sun, Zhe, Zhao, Aidi, Zeng, Xiao Cheng, Wu, Changzheng, Xie, Yi

Journal:

Advanced Materials

Year:

2017

Language:

english

File:

PDF, 2.15 MB

english, 2017

49

Early Cretaceous high-Ti and low-Ti mafic magmatism in Southeastern Tibet: Insights into magmatic evolution of the Comei Large Igneous Province

Wang, Yaying, Zeng, Lingsen, Asimow, Paul, Gao, Li-E, Ma, Chi, Antoshechkina, Paula, Guo, Chunli, Hou, Kejun, Tang, Suohan

Journal:

Year:

2017

Language:

english

File:

PDF, 2.89 MB

english, 2017

50

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land Pad

Zeng, Kejun, Williamson, Jaimal

Year:

2018

Language:

english

File:

PDF, 1.54 MB

english, 2018

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